Analysis of warpage and residual stress in plastic ball grid array package...
AbstractPurpose – The purpose of this paper is to provide a design and material selection guideline for a plastic ball grid array (PBGA) package in order to improve its reliability and manufacturing...
View ArticleA dual-band voltage-controlled oscillator in 0.13?µm CMOS technology
AbstractPurpose – The purpose of this paper is to design and implement a fully integrated low-phase noise and large tuning range dual-band LC voltage-controlled oscillator (VCO) in 0.13?µm...
View ArticleFinite element modeling of channel sag in LTCC
AbstractPurpose – In microfluidic channel fabrication in low temperature co-fired ceramics (LTCC), one of the biggest challenges is the elimination of channel deformation during lamination. The purpose...
View ArticleA new time-dependent mobility degradation model for MOS transistors
AbstractPurpose – The purpose of this paper is to propose a time-dependent mobility degradation model which is independent from the process or operating conditions. Design/methodology/approach – In...
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